Flexible Electronics News

Optomec to Feature Systems for 3D Printed Electronics at UK Advanced Packaging Conference

Will show how additive manufacturing is being used to print functional circuits onto both planar and non-planar substrates.

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By: DAVID SAVASTANO

Editor, Ink World Magazine

Optomec will feature its Aerosol Jet systems for 3D electronics at the iMAPS MicroTech Advanced Packaging and Technology Trends conference. The conference will take place at the Rutherford Appleton Laboratory (RAL) in England on March 16. Urs Berger, director of European sales for Optomec, will give a presentation in the Advanced Packaging track entitled “Using Additive Manufacturing to Add Value to Products Produced with Conventional Manufacturing Methods” at 14:00 on March 16.   Berger’s pre...

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